Master’s in Power Electronics Engineering (Specialisation)
Online master's programme of 1,900 hours in power electronics engineering: 12 modules covering Si, SiC and GaN semiconductors, isolated and non-isolated DC-DC converters, inverters, PFC, control, magnetics, thermal design and EMC, with an assigned technical tutor.
Take the controls.
Run a real engineering trade-off from this programme. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Analyse the static and dynamic behaviour of Si, SiC and GaN power semiconductors.
Design isolated and non-isolated DC-DC converters from real specifications.
Size inverters and active rectifiers using advanced modulation techniques.
Model and compensate analogue and digital control loops.
Design suitable magnetic components and cooling systems.
Apply layout and filtering criteria to meet electromagnetic compatibility limits.
Experimentally validate a complete converter and document its performance.
Who it's for
- Power electronics engineers looking to deepen their converter design expertise.
- Power supply designers moving into high-efficiency SiC and GaN designs.
- Electric vehicle converter engineers.
- Photovoltaic inverter engineers.
- Hardware validation engineers working on power stages.
- Electromagnetic compatibility specialists.
- Engineering or science graduates aiming to enter the electric mobility sector.
What you'll work with
- IEC 62477-1 (safety requirements for power electronic converter systems)
- IEC 61000-3-2 (limits for harmonic current emissions)
- IEC 61000-4-5 (surge immunity testing)
- IEEE 519 (harmonic control in electric power systems)
- IEC 60747-9 (semiconductor devices: IGBTs)
- CISPR 11 (EMC emissions for industrial, scientific and medical equipment)
- IEC 62368-1 (safety of audio/video, information and communication technology equipment)
- UL 1741 (inverters and converters for distributed energy resources)
- LTspice
- PLECS
- MATLAB/Simulink
- Ansys Maxwell
- Altium Designer
12 modules · 1900 h
1.1Power diodes and reverse recovery1.2Silicon MOSFETs: structure and losses1.3IGBTs: switching and tail current1.4Thyristors, GTOs and IGCTs in high voltage1.5Silicon carbide (SiC) in switching1.6Gallium nitride (GaN) and HEMT transistors1.7Safe operating area and avalanche1.8Datasheets and dynamic parameters1.9Device selection by application1.10Lab: double-pulse characterisation
2.1Buck, boost and buck-boost topologies2.2Continuous and discontinuous conduction mode2.3Current and voltage ripple2.4Synchronous converters and dead times2.5Interleaved multiphase converters2.6SEPIC, Ćuk and Zeta topologies2.7Output filter design2.8Efficiency and loss budget2.9Point-of-load regulators2.10Practical exercise: design of a 12 V/1 V synchronous buck
3.1Flyback: energy transfer and snubbers3.2Forward with transformer reset3.3Phase-shifted full bridge3.4Half bridge and push-pull3.5LLC resonant converter3.6Secondary-side synchronous rectification3.7Galvanic isolation and creepage distances3.8Optocoupler and TL431 feedback3.9Auxiliary supplies for drivers3.10Case study: 60 W flyback power supply
4.1Single-phase H-bridge inverter4.2Two-level three-phase inverter4.3Sinusoidal PWM modulation4.4Space vector modulation (SVPWM)4.5NPC and T-type multilevel inverters4.6Modular multilevel converters (MMC)4.7Harmonics and output distortion4.8LC and LCL output filters4.9Dead-time compensation4.10Lab: three-phase inverter with SVPWM
5.1Diode and thyristor rectifiers5.2Controlled rectification and firing angle5.3Critical-mode boost PFC5.4Bridgeless totem-pole PFC5.5Three-phase active rectifiers5.6Three-level Vienna rectifier5.7Grid harmonic emission limits5.8Input current control5.9Part-load efficiency5.10Practical exercise: 1 kW PFC stage
6.1State-space averaged model6.2Control-to-output transfer function6.3Voltage-mode control6.4Peak current-mode control6.5Type II and type III compensators6.6Phase margin and transient response6.7Digital control with DSP and microcontroller6.8Sampling delays and quantisation6.9Loop measurement with a frequency response analyser6.10Workshop: compensation of a boost converter
7.1Core materials: ferrite and powder7.2Core losses and the Steinmetz equation7.3Copper losses and proximity effect7.4Design of gapped inductors7.5Design of high-frequency transformers7.6Litz wire and planar windings7.7Leakage inductance and parasitic capacitance7.8Saturation and peak current7.9Magnetic design tools7.10Practical exercise: design of an output inductor
8.1Gate drive circuits8.2Isolated drivers and bootstrap supply8.3dv/dt immunity and CMTI8.4Desaturation detection8.5Overcurrent protection8.6Active clamping and overvoltages8.7Switching speed control8.8Current measurement with shunt and Hall sensors8.9Start-up and shutdown sequences8.10Lab: isolated driver for SiC
9.1Junction-to-ambient thermal resistance9.2Foster and Cauer thermal models9.3Heatsinks and forced cooling9.4Liquid cooling with cold plates9.5Thermal interface materials9.6Power cycling and solder fatigue9.7Capacitor lifetime prediction9.8Reliability analysis and failure rate9.9Component derating9.10Case study: thermal sizing of an inverter
10.1Switching loops and parasitic inductance10.2Multilayer power PCB design10.3Common-mode and differential-mode conducted emissions10.4Input EMI filters10.5Radiated emissions and shielding10.6LISN network and pre-compliance measurement10.7Grounding and current return paths10.8Spread spectrum in switching frequency10.9Immunity to transients and surge10.10Lab: conducted emissions measurement
11.1Photovoltaic inverters and MPPT11.2Electric vehicle on-board chargers11.3Bidirectional converters for batteries11.4Industrial motor drives11.5Solid-state transformers11.6HVDC transmission and FACTS11.7Power supplies for data centres11.8Uninterruptible power supplies11.9Microgrids and grid-forming converters11.10Case study: 11 kW on-board charger
12.1Converter definition and specifications12.2Topology and semiconductor selection12.3Circuit and loss simulation12.4Magnetic and thermal design12.5PCB design and EMC plan12.6Prototyping and experimental validation12.7Analysis of results and efficiency12.8Conclusions and lines of improvement12.9Master's Thesis report12.10Master's Thesis: defence before a panel
How you'll learn
100% online training on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. No fixed timetables: you progress at your own pace within the intake, making it compatible with work.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is LTspice, PLECS, MATLAB/Simulink, Ansys Maxwell and Altium Designer, in free, academic or evaluation versions. Testing is studied through real procedures: double-pulse tests on SiC and GaN semiconductors, efficiency and conducted emissions measurement on prototypes, and thermal validation with thermography and thermocouples. Assessment is continuous by module, plus the final Master's Thesis.
Standards covered: IEC 62477-1, IEC 61000-3-2, IEC 61000-4-5, IEEE 519, IEC 60747-9, CISPR 11, IEC 62368-1, UL 1741.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Where this takes you
Requirements
- A university degree in engineering, science or architecture, or equivalent demonstrable professional experience.
- An internet connection and a computer capable of running the programme's software.
- English sufficient to read technical standards.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme totals 1,900 hours over 12–14 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.
You work with LTspice, PLECS, MATLAB/Simulink, Ansys Maxwell and Altium Designer, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.
A SEIUM Institute diploma, awarded on passing the continuous assessment and the Master's Thesis. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.
Yes. Modules passed in a course or postgraduate diploma in the same area are recognised in the higher programme. Ask about the recognition policy when you enrol.
A university degree in engineering, science or architecture (or equivalent professional experience), a computer able to run the programme's software and English sufficient to read technical standards.
Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.
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