Aerodynamics/CFD, set-up, vehicle dynamics, telemetry, ERS/batteries, composites, quality/metrology.
Hire talent
- Connect with international technical talent ready to deliver. Profiles across automotive & motorsport, aerospace/UAM, naval & offshore, rail & smart cities, energy & grids, electronics/embedded/telecoms, robotics/automation, data/AI/simulation, design/HMI, RAMS & compliance, and technology business.
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Why SEIUM
Innovation that transforms, learning that evolves, and technology that drives progress.
What can you hire through SEIUM?
Career Fairs & Talent Days (on-campus / virtual)
Direct access to candidates by vertical, with 1:1 agendas, technical talks, and digital booths.
Internships / co-ops (12–24 weeks)
Advanced students embedded in teams with measurable objectives.
Co-supervised TFM/TFG (16–24 weeks)
Projects with real deliverables, under an NDA and a clear intellectual property framework.
International junior / graduate talent
Access to our global cohorts (ES/EN), plus mobility/visa support coordinated with your HR team.
On-demand pipelines (partial RPO)
When you need multiple profiles in a short timefra
Technical assessments and onboarding bootcamps
We close critical gaps before onboarding (SDV/ADAS, ISO 26262/SOTIF, DO-178C/254, IEC 62443/OT, BMS/SoX, HVDC/BESS, TSN/IIoT, MBSE/PLM, HIL/SIL, CFD/FEA).
Profiles and disciplines
DO-178C/254, avionics/I&C, structures/composites, GNC, eVTOL/SC-VTOL, testing (DO-160).
Naval architecture, hydrodynamics/CFD, propulsion (LNG/MeOH/H₂), offshore/subsea, shipyard operations.
ETCS/CBTC, electrification, signalling, BIM/Lean, ITS/V2X, operations/control centres.
ADMS/DMS, HVDC/FACTS, BESS/grid-forming, markets, H₂/PtX, buildings/district heating networks.
RTOS/Linux, AUTOSAR, high-speed PCBs, SiC/GaN power electronics, EMC/EMI, RF/5G/6G, V2X.
Cobots, AMR/SLAM, 3D vision, PLC/DCS/SCADA, MPC, TSN/IIoT.
MLOps, time series, OR, digital twins (CFD/FEA/HPC), 3D vision, synthetic data.
ISO 26262/SOTIF, ISO/SAE 21434/OTA, UNECE/NCAP, EN 17025, EU AI Act, NERC CIP, IAEA.
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Collaboration models and frameworks
Documentation and compliance
- Standard NDA (or the client’s framework).
- Tripartite internship agreement, or a TFM/TFG addendum (IP/deliverables).
- IP clauses (background/sideground/foreground).
- Export Controls & IHL check: ITAR/EAR/dual-use classification, end-use/end-user, and ethical restrictions (non-operational/offensive use prohibited).
- GDPR / privacy: privacy by design, data minimisation, retention/deletion, encrypted repositories.
- HSE / Safety: lab onboarding, stop-the-line authority, equipment permits.
Mobility and visa support (high level)
We coordinate with your HR / legal team.
- EU / Spain: internships (curricular/extracurricular), internship permits, arraigo de prácticas where applicable.
- US (e.g., J-1 / F-1 OPT/CPT), Japan, China, and other regions: indicative timelines and typical documentation (not legal advice).
- Invitation letter/contract, coverage plans, and realistic start dates.
SEIUM does not provide immigration legal advice; we work with your counsel and provide the required academic documentation.
Metrics and guarantees
Employer branding with SEIUM
Technical talks and real-world case studies in class.
Sponsored challenges (hackathons, design sprints).
Corporate scholarships (merit/diversity) and naming rights for labs/teams.
Co-created content (success stories, videos, technical blog posts).
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Process and SLAs (from brief to onboarding)
- Rellenasformulario de vacante o nos envías tu JD.
You complete the vacancy form or send us your job description.
We align on the profile, stack, languages, location, visa, salary, and SLA. - Alineamos perfil, stack, idiomas, ubicación, visa, salario y SLA.
- Sourcing across our cohorts and alumni community.
- Technical pre-fit (screening by SEIUM engineers) and culture fit.
3–6 candidates with scorecards (skills, projects, languages, availability).
Vertical-specific technical assessment (when applicable) + interview.
References, offer, visa process kick-off (if applicable), and an onboarding plan.
shortlist en ≤10 días laborables desde brief completo. Incorporación.
Job Brief Template (copy/paste)
Role title:
Location / mode: (on-site/hybrid/remote; city/country)
Language(s): (ES/EN/other)
Type: (internship/Final Project (TFG/TFM)/co-op/junior/graduate)
Duration / start: (weeks/months; earliest/latest start date)
Key stack / standards: (e.g., C/C++, AUTOSAR Adaptive, ROS 2/DDS, ISO 26262, DO-178C, IEC 62443, BMS, HVDC, CFD/FEA…)
Hard skills (must-have / nice-to-have):
Soft skills: (teamwork, technical communication, ownership)
Main responsibilities: (3–5 concrete bullet points)
Compensation / benefits: (range/stipend; meal voucher, transport, etc.)
Legal requirements: (eligibility/visa)
HR contact: (email + name)
- Send your brief to
- partners@seium.university
- Form
