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Postgraduate DiplomaElectronics, Embedded Systems & Telecom Applications open

Diploma in Derating, MTBF and Failure Analysis

Online postgraduate diploma of 800 hours in derating, MTBF and failure analysis. 8 modules covering applied reliability, component derating, reliability prediction, FMEA and systematic analysis, failure analysis techniques, common failure mechanisms and lifecycle reliability, with an assigned technical tutor.

Duration6–8 months
ModeOnline
LanguageEnglish
Start datesSet by the faculty
AwardSEIUM Institute diploma
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Learning outcomes

What you will be able to do

01

Calculate reliability indicators such as MTBF, FIT and availability.

02

Apply derating rules to passive, active and electromechanical components.

03

Predict failure rates with MIL-HDBK-217F, FIDES and Telcordia.

04

Prepare FMEAs and fault trees for electronic products.

05

Select laboratory techniques for failure analysis.

06

Determine the root cause of failures and propose corrective actions.

07

Manage field reliability through a FRACAS system.

Profile

Who it's for

  • Reliability engineers responsible for predictions and derating reviews.
  • Failure analysts working in electronics laboratories.
  • Quality engineers handling returns, 8D reports and corrective actions.
  • Component engineers dealing with selection, obsolescence and counterfeits.
  • FRACAS managers who track and close out field failures.
  • RAMS engineers in railway, aerospace and defence projects.
  • Engineering or science graduates looking to enter the railway sector.
Standards & tools

What you'll work with

  • MIL-HDBK-217F (reliability prediction of electronic equipment)
  • IEC 61709 (electronic components, reference conditions for failure rates and stress models)
  • Telcordia SR-332 (reliability prediction procedure for electronic equipment)
  • FIDES 2009 (reliability methodology for electronic systems)
  • ECSS-Q-ST-30-11C (derating of EEE components for space)
  • IEC 60812 (failure modes and effects analysis, FMEA and FMECA)
  • IEC 61025 (fault tree analysis)
  • AIAG-VDA FMEA (failure mode and effects analysis handbook)
  • ReliaSoft BlockSim
  • Isograph Reliability Workbench
  • ALD RAM Commander
  • ReliaSoft Lambda Predict
  • Ansys Sherlock
Syllabus

8 modules

  1. 1.1Failure rate, MTBF and MTTF
  2. 1.2Reliability, availability and maintainability
  3. 1.3Mission profiles and use environments
  4. 1.4FIT units and their interpretation
  5. 1.5Exponential distribution and constant failure rate
  6. 1.6Contractual reliability requirements
  7. 1.7Series and redundant reliability blocks
  8. 1.8Inherent and operational availability
  9. 1.9Limitations of MTBF as an indicator
  10. 1.10Practical: calculating the MTBF of a subsystem
  1. 2.1Derating philosophy and design margins
  2. 2.2Derating of resistors and capacitors
  3. 2.3Derating of power semiconductors
  4. 2.4Derating of connectors and relays
  5. 2.5Power versus temperature curves
  6. 2.6Voltage, current and junction temperature
  7. 2.7NASA and ECSS derating guidelines
  8. 2.8Systematic schematic review
  9. 2.9Exceptions and technical justification
  10. 2.10Workshop: derating sheet for a board
  1. 3.1MIL-HDBK-217F prediction methodology
  2. 3.2FIDES method and process factors
  3. 3.3Telcordia SR-332 and parts count
  4. 3.4Parts stress analysis
  5. 3.5IEC 61709 and reference conditions
  6. 3.6Failure rate databases
  7. 3.7Quality and environment factors
  8. 3.8Comparison of prediction methods
  9. 3.9Sensitivity to operating temperature
  10. 3.10Lab: prediction with FIDES and Telcordia
  1. 4.1Design and process FMEA
  2. 4.2Severity, occurrence and detection scales
  3. 4.3Action priority according to AIAG-VDA
  4. 4.4FMECA and criticality
  5. 4.5Fault tree analysis (FTA)
  6. 4.6Reliability block diagrams
  7. 4.7Common cause analysis
  8. 4.8Integration with functional safety requirements
  9. 4.9Tracking corrective actions
  10. 4.10Case study: FMEA of a switched-mode power supply
  1. 5.1Failure analysis workflow in electronics
  2. 5.2Optical inspection and stereo microscopy
  3. 5.3X-ray and computed tomography
  4. 5.4Microsectioning and metallography
  5. 5.5SEM electron microscopy and EDX analysis
  6. 5.6Lock-in thermography and hot-spot detection
  7. 5.7Decapsulation of integrated circuits
  8. 5.8Ionic contamination analysis
  9. 5.9Evidence documentation and chain of custody
  10. 5.10Lab: analysis of a failed capacitor
  1. 6.1Solder joint fatigue
  2. 6.2Cracks in ceramic capacitors
  3. 6.3Electromigration and electrochemical migration
  4. 6.4Tin whiskers
  5. 6.5Electrostatic discharge damage
  6. 6.6Electrical overstress (EOS)
  7. 6.7Via failures and CAF in PCBs
  8. 6.8Degradation of electrolytic capacitors
  9. 6.9Corrosion from aggressive atmospheres
  10. 6.10Case study: field failure due to CAF
  1. 7.1Reliability programmes according to IEC 60300
  2. 7.2FRACAS failure reporting systems
  3. 7.3Analysis of returns and warranty data
  4. 7.4Field reliability indicators
  5. 7.58D analysis and problem solving
  6. 7.6Component obsolescence management
  7. 7.7Counterfeit components and their detection
  8. 7.8Reliability-focused design reviews
  9. 7.9Communication with suppliers
  10. 7.10Workshop: implementing a FRACAS
  1. 8.1Product description and mission profile
  2. 8.2Complete derating analysis
  3. 8.3MTBF prediction using two methods
  4. 8.4Design FMEA of the product
  5. 8.5Analysis of a real or simulated failure
  6. 8.6Root cause determination
  7. 8.7Corrective action plan
  8. 8.8Monitoring indicators
  9. 8.9Report and presentation
  10. 8.10Final project: final review with the tutor
Methodology, software & labs

How you'll learn

Delivered 100% online on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There are no fixed timetables: you progress at your own pace within each intake, so the programme fits around your job.

Each module combines theory, guided reading of the original standard and applied exercises. The working software is ReliaSoft BlockSim, Isograph Reliability Workbench, ALD RAM Commander, ReliaSoft Lambda Predict and Ansys Sherlock, in free, academic or evaluation versions. Testing is studied through real procedures: laboratory analysis of field failures, schematic derating reviews and design FMEA audits. Assessment is continuous by module, plus the final integrating project.

Standards covered: MIL-HDBK-217F, IEC 61709, Telcordia SR-332, FIDES 2009, ECSS-Q-ST-30-11C, IEC 60812, IEC 61025, AIAG-VDA FMEA.

Assigned technical tutor:every module ends with a deliverable that your tutor marks individually.
Standards-based learning:guided reading of MIL-HDBK-217F, IEC 61709 and Telcordia SR-332 applied to real cases, not as a theoretical annex.
Industry software:ReliaSoft BlockSim, Isograph Reliability Workbench, ALD RAM Commander, ReliaSoft Lambda Predict and Ansys Sherlock, in free, academic or evaluation versions.
Final project:a reliability and failure analysis project covering derating, MTBF prediction, design FMEA and root cause analysis, reviewed by your tutor.
Flexible format:100% online, no fixed timetables, compatible with full-time work.
Capstone project

Build it end to end

Your final project follows the real engineering workflow, step by step, reviewed by your tutor.

Mission profile and derating
Describe the product and its mission profile and carry out a complete derating analysis.
Two-method MTBF prediction
Predict the product MTBF using two prediction methods and compare the results.
Design FMEA
Prepare the design FMEA of the product and prioritise actions.
Failure and root cause analysis
Analyse a real or simulated failure and determine its root cause.
Final project
Present the corrective action plan and monitoring indicators, reviewed by your tutor.
Career opportunities

Where this takes you

Reliability engineerFailure analystQuality engineerComponent engineerFRACAS managerRAMS engineer
Admissions & scholarships

Requirements

  • Prior technical training or professional experience in the sector. No university degree is required.
  • Internet connection and a computer capable of running the programme software.
  • English sufficient to read technical standards.

Ready to start?

Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.

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FAQ

Frequently asked questions

The programme totals 800 hours over 6–8 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.

You work with ReliaSoft BlockSim, Isograph Reliability Workbench, ALD RAM Commander, ReliaSoft Lambda Predict and Ansys Sherlock, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.

A SEIUM Institute diploma, awarded on passing the continuous assessment and the final project. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.

Yes. Modules passed are recognised in a higher programme in the same area (postgraduate diploma or master's). Ask about the recognition policy when you enrol.

Prior technical training or professional experience in the sector (no university degree required), a computer able to run the programme software, and English sufficient to read technical standards.

Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.

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