Diploma in Thermal Management and Insulation
Online postgraduate diploma of 800 hours in thermal management and insulation. 8 modules covering the thermal behaviour of power converters, air and liquid cooling, interface materials and potting, high-voltage insulation coordination, thermal-dielectric interaction, multiphysics simulation and testing and reliability, with an assigned technical tutor.
Take the controls.
Run a real engineering trade-off from this field. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Calculate the thermal chain of power modules and their transient impedance.
Size air and liquid cooling systems.
Select thermal interface materials according to conductivity and insulation.
Coordinate insulation in high-voltage DC systems.
Analyse the interaction between temperature and dielectric behaviour.
Simulate the multiphysics behaviour of cooled converters.
Plan cycling and dielectric tests to estimate service life.
Who it's for
- Power electronics thermal engineers.
- Electrical insulation engineers.
- Power module engineers.
- EV charger engineers.
- Multiphysics simulation engineers.
- Power reliability engineers.
- Engineering or science graduates aiming to enter the electric vehicle sector.
What you'll work with
- IEC 60664-1 (insulation coordination for equipment within low-voltage systems)
- IEC 61800-5-1 (adjustable speed electrical power drive systems — safety requirements)
- ECPE AQG 324 (qualification of power modules for use in power electronics converter units in motor vehicles)
- IEC 60749-34 (semiconductor devices — power cycling)
- JEDEC JESD51-14 (transient dual interface test method for junction-to-case thermal resistance)
- ASTM D5470 (thermal transmission properties of thermally conductive electrical insulation materials)
- IEC 60270 (partial discharge measurements)
- IEC 61851-23 (DC electric vehicle charging station)
- Ansys Icepak
- Simcenter Flotherm
- COMSOL Multiphysics
- Ansys Fluent
- Semikron SemiSel
8 modules
1.1Loss map of a power converter1.2Junction temperature and semiconductor limits1.3Junction-substrate-heatsink thermal chain1.4IGBT and SiC modules and their structure1.5DBC, AMB and IMS substrates1.6Solders and silver sintering1.7Transient thermal impedance1.8Thermal coupling between chips1.9Thermal requirements in the customer specification1.10Practical exercise: junction temperature calculation for a module
2.1Finned and extruded heatsinks2.2Fans, fan curves and operating point2.3Cold plates with channels and pin fins2.4Glycol-water and dielectric coolants2.5Pumps, flow rate and pressure drop2.6Heat exchangers and secondary circuits2.7Two-phase and evaporative cooling2.8Cooling of high-power cables2.9Acoustic noise of cooling systems2.10Workshop: sizing a cold plate
3.1Thermal greases and phase-change materials3.2Gap fillers and thermal pads3.3Graphite and anisotropic materials3.4Conductive fillers and potting compounds3.5Interface ageing and pump-out3.6Conductivity measurement according to ASTM D54703.7Selection by insulation and conductivity3.8Application process in manufacturing3.9Delamination failures3.10Lab: comparison of interface materials
4.1400 V and 800 V DC systems4.2Overvoltage categories and impulses4.3Clearances on power boards4.4Creepage distances and pollution degree4.5Barriers, coatings and conformal coating4.6Insulation of substrates and modules4.7Insulation between primary and SELV circuits4.8Altitude and distance correction4.9Insulation monitoring in IT systems4.10Case study: insulation coordination of a charger
5.1Effect of temperature on dielectric strength5.2Partial discharges in power modules5.3Humidity, condensation and insulation5.4Thermal ageing of polymers5.5Materials that conduct heat and insulate5.6Electrical treeing in potting compounds5.7dv/dt stress on hot insulation5.8Thermal cycling and cracks in insulators5.9Combined temperature and voltage tests5.10Practical exercise: partial discharge measurement at temperature
6.1Thermal models of power modules6.2CFD of liquid-cooled systems6.3Electric fields in insulating barriers6.4Electrothermal coupling of losses6.5Simulation of real load cycles6.6Heatsink geometry optimisation6.7Reduced-order models for control6.8Thermal digital twin6.9Model validation against measurements6.10Lab: CFD simulation of a cold plate
7.1Power cycling according to AQG 3247.2Passive thermal cycling7.3H3TRB humidity tests under bias7.4Type and routine dielectric tests7.5Thermography and optical fibre in testing7.6Leak tests on liquid circuits7.7Lifetime estimation with cycling models7.8Module health monitoring7.9Analysis of thermal and dielectric failures7.10Case study: lifetime of a traction module
8.1Converter and environment specification8.2Loss balance and thermal targets8.3Cooling system design8.4Selection of interface materials8.5Insulation coordination8.6Multiphysics simulation of the assembly8.7Validation test plan8.8Conclusions and improvement proposals8.9Report and presentation8.10Final project: final review with your tutor
How you'll learn
100% online training on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. No fixed timetables: you progress at your own pace within each intake, so you can combine it with your job.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is Ansys Icepak, Simcenter Flotherm, COMSOL Multiphysics, Ansys Fluent and Semikron SemiSel, in free, academic or evaluation versions. Testing is studied through real procedures for power cycling tests on modules, partial discharge measurements on insulated assemblies and thermal validation of cold plates with optical fibre. Assessment is continuous by module, plus the final project.
Standards covered: IEC 60664-1, IEC 61800-5-1, ECPE AQG 324, IEC 60749-34, JEDEC JESD51-14, ASTM D5470, IEC 60270, IEC 61851-23.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Where this takes you
Requirements
- Prior technical training or professional experience in the sector. No university degree is required.
- Internet connection and a computer capable of running the programme software.
- English sufficient to read technical standards.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme totals 800 hours over 6–8 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.
You work with Ansys Icepak, Simcenter Flotherm, COMSOL Multiphysics, Ansys Fluent and Semikron SemiSel, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.
A SEIUM Institute diploma, awarded on passing the continuous assessment and the final project. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.
Yes. Modules passed are recognised in a higher programme in the same area (postgraduate diploma or master's). Ask about the recognition policy when you enrol.
Prior technical training or professional experience in the sector (no university degree required), a computer able to run the programme software and English sufficient to read technical standards.
Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.
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