Postgraduate Diploma in Interconnection Architectures and Flexible Electronics
Online 800-hour Postgraduate Diploma in Interconnection Architectures and Flexible Electronics. 8 modules covering IPC-2223 (flexible printed circuit design), IPC-6013 (flexible printed circuit qualification) and Altium Designer. Assigned tutor and open enrolment.
Take the controls.
Run a real engineering trade-off from this field. Move the sliders, watch the model react in real time and beat the challenge.
What you will be able to do
Distinguish between flexible, stretchable and printed electronics technologies.
Select substrates and conductive materials according to mechanical and electrical requirements.
Compare manufacturing processes such as screen printing, inkjet and copper lamination.
Design reliable interconnections and assemblies between rigid and flexible zones.
Apply design rules for bend radii and dynamic zones.
Assess reliability through flex testing and environmental cycling.
Integrate flexible circuits into end products with manufacturability criteria.
Who it's for
- Flexible electronics engineer who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Electronics manufacturing process engineer who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Packaging and interconnection engineer who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Reliability engineer who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Flexible circuit designer who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Researcher in printed electronics who wants to specialise in Interconnection Architectures and Flexible Electronics.
- Engineering or science graduates looking to enter wearables.
What you'll work with
- IPC-2223 (flexible printed circuit design)
- IPC-6013 (flexible printed circuit qualification)
- IPC-A-610 (acceptability of electronic assemblies)
- IPC J-STD-001 (soldering requirements)
- IEC 62899 (printed electronics)
- JEDEC JESD22-A104 (temperature cycling)
- IPC-TM-650 (test methods)
8 modules · 800 h
1.1Substrates: polyimide, PET, TPU and silicone1.2Flexible versus stretchable electronics1.3Mechanics of thin films1.4Bend radius and strain1.5Serpentine and zigzag interconnects1.6Electronics in textiles1.7Applications in medical wearables1.8Industry status and suppliers1.9Reliability challenges1.10Case study: analysis of a commercial monitoring patch
2.1Laminated and electrodeposited copper2.2Silver and carbon inks2.3Conductive polymers: PEDOT:PSS2.4Liquid metals2.5Silver nanowires and graphene2.6Textile conductive yarns2.7Sheet resistance and piezoresistivity2.8Isotropic and anisotropic conductive adhesives2.9Encapsulants and moisture barriers2.10Laboratory: resistance measurement under stretching
3.1Flexible circuits by photolithography3.2Screen printing of printed electronics3.3Inkjet and aerosol jet printing3.4Lamination and multilayer structures3.5Rigid-flex circuits3.6Roll-to-roll manufacturing3.7Embroidery and weaving of conductors3.8Moulding electronics in silicone3.9In-line quality control3.10Practice: designing a circuit for screen printing
4.1Mounting components on flexible substrates4.2Low-temperature soldering4.3Bonding with ACF and ACP4.4ZIF and FPC connectors4.5Flexible-to-rigid joints4.6Wire bonding and flip chip4.7Reinforcements and stiffeners4.8Stiffness transitions4.9Encapsulation of joints4.10Workshop: designing the connection of a sensor to a flexible circuit
5.1IPC-2223 flexible design standards5.2Dynamic and static zones5.3Routing around bends5.4Layer stack-up and symmetry5.5Controlled impedance in flexible circuits5.6Antennas on flexible substrates5.7Design of integrated electrodes5.8EDA tools for flexible circuits5.9Manufacturability and costs5.10Practice: designing a flexible circuit for an ECG patch
6.1Failure mechanisms: cracking and delamination6.2IPC-TM-650 cyclic flex tests6.3Cyclic stretch tests6.4Humidity, sweat and corrosion6.5Laundering of electronic textiles6.6Thermal and thermal shock tests6.7Failure analysis by microscopy6.8Fatigue modelling6.9Biocompatibility of contact materials6.10Laboratory: cyclic flex test of an interconnect
7.1Integration with flexible batteries7.2Thermal management on thin substrates7.3Skin attachment and medical adhesives7.4Comfort and ergonomics7.5Sustainability and recycling7.6Scaling from prototype to series production7.7Regulatory requirements for the device7.8Supplier selection7.9Production costs7.10Case study: industrialising a sensor-equipped shirt
8.1Defining the wearable8.2Material selection8.3Circuit design8.4Interconnection strategy8.5Manufacturing process8.6Reliability plan8.7Product integration8.8Cost analysis8.9Report and presentation8.10Final review with the tutor
How you'll learn
A 100% online programme on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. There is no fixed timetable: students progress at their own pace within the intake, which makes it possible to combine study with work.
Each module combines theory, guided reading of the original standard and applied exercises. The working software is Altium Designer, Cadence Allegro, ANSYS Mechanical, COMSOL Multiphysics, in free, academic or evaluation versions. Tests are studied using real procedures for dynamic flex testing, thermal cycling and cross-section microscopy. Assessment is continuous, module by module, plus the final integrating project.
Build it end to end
Your final project follows the real engineering workflow, step by step, reviewed by your tutor.
Distinguish between flexible, stretchable and printed electronics technologies.
Select substrates and conductive materials according to mechanical and electrical requirements.
Compare manufacturing processes such as screen printing, inkjet and copper lamination.
Design reliable interconnections and assemblies between rigid and flexible zones.
Apply design rules for bend radii and dynamic zones.
Where this takes you
Requirements
- Prior technical training or professional experience in the sector. No university degree is required.
- Internet connection and a computer capable of running the programme's software.
- Sufficient command of Spanish to follow technical standards documentation.
Ready to start?
Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.
Frequently asked questions
The programme consists of 800 hours in total, spread over 6 to 8 months. That is an average of 10 to 15 hours per week, compatible with a full-time job.
You will work with Altium Designer, Cadence Allegro, ANSYS Mechanical and COMSOL Multiphysics. Free, academic or evaluation versions are used, and the tutor will indicate the free alternative where one exists.
A SEIUM Institute diploma upon passing the continuous assessment and the integrating project. It is an in-house qualification, not an official title from the Ministry.
Yes. Modules passed in a Course or Postgraduate Diploma in the same area are credited towards the higher-level programme. Check the recognition policy when you enrol.
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