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Master'sRobotics, Automation & Control Applications open

Master’s in Electronics Engineering

Online master's programme of 1,900 hours in electronics engineering. 12 modules covering analogue and digital electronics, embedded systems, power electronics, motor drives, sensors, PCB design, EMC, communications and product reliability, with an assigned technical tutor.

Duration1900 h
ModeOnline
LanguageEnglish
Start datesSet by the faculty
AwardSEIUM Institute diploma
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Learning outcomes

What you will be able to do

01

Analyse and design analogue and digital circuits.

02

Programme microcontrollers and FPGAs.

03

Design power electronics converters.

04

Control electric motors using vector techniques.

05

Design manufacturable printed circuit boards.

06

Apply electromagnetic compatibility criteria.

07

Validate electronic products against the applicable standards.

Profile

Who it's for

  • Electronics engineers looking to broaden their design skills.
  • Hardware designers.
  • Firmware developers.
  • Power electronics engineers.
  • Test and validation engineers.
  • Electronic product engineers.
  • Engineering or science graduates seeking to enter industrial automation.
Standards & tools

What you'll work with

  • IPC-2221B (generic standard on printed board design)
  • IPC-A-610H (acceptability of electronic assemblies)
  • Directive 2014/30/EU requirements (electromagnetic compatibility)
  • IEC 62368-1:2023 (safety of audio/video, information and communication technology equipment)
  • Directive 2011/65/EU (RoHS) (restriction of hazardous substances)
  • IEC 61000-6-2:2016 (immunity for industrial environments)
  • IEC 60034-30-1:2014 (efficiency classes of line-operated AC motors)
  • IEC 61131-9:2022 (IO-Link single-drop digital communication interface)
  • KiCad
  • LTspice
  • STM32CubeIDE
  • Vivado
  • MATLAB/Simulink
Syllabus

12 modules · 1900 h

  1. 1.1Kirchhoff's laws and nodal analysis
  2. 1.2Resistors, capacitors and inductors
  3. 1.3Diodes and rectification
  4. 1.4Bipolar transistors and MOSFETs
  5. 1.5Thévenin and Norton theorems
  6. 1.6Frequency response and passive filters
  7. 1.7Circuit simulation with SPICE
  8. 1.8Datasheets and component selection
  9. 1.9Tolerances and worst-case analysis
  10. 1.10Lab: characterisation of a MOSFET
  1. 2.1Ideal and real operational amplifiers
  2. 2.2Inverting and non-inverting configurations
  3. 2.3Instrumentation amplifiers
  4. 2.4Sallen-Key active filters
  5. 2.5Comparators and hysteresis
  6. 2.6Voltage references
  7. 2.7Noise in analogue circuits
  8. 2.8Stability and compensation
  9. 2.9Analogue-to-digital conversion and sampling
  10. 2.10Practical exercise: bridge signal conditioning
  1. 3.1Combinational and sequential logic
  2. 3.2Flip-flops and registers
  3. 3.3Finite state machines
  4. 3.4Logic families and levels
  5. 3.5VHDL and Verilog languages
  6. 3.6FPGAs and their architecture
  7. 3.7Synthesis and timing constraints
  8. 3.8Simulation of digital designs
  9. 3.9High-speed interfaces
  10. 3.10Lab: state machine on an FPGA
  1. 4.1ARM Cortex-M microcontroller architecture
  2. 4.2GPIO, ADC and timer peripherals
  3. 4.3Interrupts and DMA
  4. 4.4Embedded C programming
  5. 4.5Real-time operating systems
  6. 4.6FreeRTOS and Zephyr
  7. 4.7SPI, I2C and UART buses
  8. 4.8Low power and sleep modes
  9. 4.9Debugging with JTAG and SWD
  10. 4.10Practical exercise: DMA acquisition on STM32
  1. 5.1Buck and boost DC-DC converters
  2. 5.2Isolated flyback and forward converters
  3. 5.3Inverters and PWM modulation
  4. 5.4SiC and GaN semiconductors
  5. 5.5Gate drivers
  6. 5.6Magnetics design
  7. 5.7Losses and thermal management
  8. 5.8Converter control
  9. 5.9Power factor correction
  10. 5.10Lab: buck converter design
  1. 6.1DC, BLDC and PMSM motors
  2. 6.2Field-oriented control (FOC)
  3. 6.3Position sensors and encoders
  4. 6.4Three-phase inverters for motors
  5. 6.5Sensorless control
  6. 6.6Drive protection
  7. 6.7Industrial variable-speed drives
  8. 6.8Motor efficiency to IEC 60034-30-1
  9. 6.9Integration with fieldbuses
  10. 6.10Practical exercise: FOC control of a PMSM motor
  1. 7.1Temperature and pressure sensors
  2. 7.2Current and Hall-effect sensors
  3. 7.3Inertial MEMS sensors
  4. 7.4Optical and proximity sensors
  5. 7.54-20 mA and HART interfaces
  6. 7.6IO-Link in sensors
  7. 7.7Calibration and uncertainty
  8. 7.8Laboratory instrumentation
  9. 7.9Data acquisition
  10. 7.10Workshop: IO-Link interface for a sensor
  1. 8.1Schematic capture
  2. 8.2PCB design rules
  3. 8.3Layer stack-up and impedance
  4. 8.4Signal integrity
  5. 8.5Power integrity
  6. 8.6Design for manufacturing (DFM)
  7. 8.7IPC-2221 and IPC-A-610 standards
  8. 8.8SMT manufacturing and assembly
  9. 8.9Board testing
  10. 8.10Practical exercise: PCB design in KiCad
  1. 9.1Coupling and sources of interference
  2. 9.2Conducted and radiated emissions
  3. 9.3Immunity and ESD
  4. 9.4Requirements of Directive 2014/30/EU
  5. 9.5EN 61000-6 standards
  6. 9.6Filtering and shielding
  7. 9.7Grounding
  8. 9.8Pre-compliance testing
  9. 9.9Design for EMC
  10. 9.10Case study: correcting the emissions of a board
  1. 10.1Industrial serial communications
  2. 10.2CAN and CAN FD
  3. 10.3Ethernet in embedded systems
  4. 10.4BLE and Wi-Fi wireless communications
  5. 10.5LoRa and LPWAN networks
  6. 10.6IoT protocols for devices
  7. 10.7Antennas and basic RF
  8. 10.8Security in connected devices
  9. 10.9Communications testing
  10. 10.10Lab: CAN node with a microcontroller
  1. 11.1Reliability and failure rate
  2. 11.2Design FMEA
  3. 11.3Environmental and climatic testing
  4. 11.4Accelerated life testing
  5. 11.5Electrical safety to IEC 62368-1
  6. 11.6RoHS and REACH
  7. 11.7CE marking of electronic equipment
  8. 11.8Component obsolescence
  9. 11.9Lifecycle management
  10. 11.10Case study: test plan for a product
  1. 12.1Electronic system specification
  2. 12.2Schematic design
  3. 12.3Embedded firmware development
  4. 12.4PCB design
  5. 12.5Assembly and commissioning
  6. 12.6Functional testing of the prototype
  7. 12.7EMC and reliability assessment
  8. 12.8Conclusions and design improvements
  9. 12.9Master's Thesis report
  10. 12.10Master's Thesis: defence before a panel
Methodology, software & labs

How you'll learn

100% online training on the SEIUM campus, with downloadable material, recorded classes and an assigned technical tutor. No fixed timetables: you progress at your own pace within the intake, making it compatible with work.

Each module combines theory, guided reading of the original standard and applied exercises. The working software is KiCad, LTspice, STM32CubeIDE, Vivado and MATLAB/Simulink, in free, academic or evaluation versions. Exercises are based on real procedures for electronic board design and assembly, microcontroller programming and EMC pre-compliance testing. Assessment is continuous by module, plus the final Master's Thesis.

Standards covered: IPC-2221B, IPC-A-610H, Directive 2014/30/EU requirements, IEC 62368-1:2023, Directive 2011/65/EU (RoHS), IEC 61000-6-2:2016, IEC 60034-30-1:2014, IEC 61131-9:2022.

Assigned technical tutor:every module ends with a deliverable that your tutor marks individually.
Standards-based learning:guided reading of IPC-2221B, IPC-A-610H and Directive 2014/30/EU applied to real cases, not as a theoretical annex.
Industry software:KiCad, LTspice, STM32CubeIDE, Vivado and MATLAB/Simulink, in free, academic or evaluation versions.
Master's Thesis with defence:The design, prototyping and validation of a complete electronic system, defended before a panel.
Flexible format:100% online, no fixed timetables, compatible with full-time work.
Capstone project

Build it end to end

Your final project follows the real engineering workflow, step by step, reviewed by your tutor.

System specification
Specify the electronic system and its functional and regulatory requirements.
Schematic and firmware
Design the schematic and develop the embedded firmware.
PCB design and assembly
Lay out the PCB, then assemble and commission the prototype.
Testing, EMC and reliability
Carry out functional testing and assess EMC and reliability.
Master's Thesis
Present the design, results and improvements in a thesis, defended before a panel.
Career opportunities

Where this takes you

Electronics engineerHardware designerFirmware developerPower electronics engineerTest and validation engineerElectronic product engineer
Admissions & scholarships

Requirements

  • University degree in engineering, science or architecture, or equivalent demonstrable professional experience.
  • Internet connection and a computer capable of running the programme software.
  • English sufficient to read technical standards.

Ready to start?

Send your application today. Our admissions team replies within 72 hours with your study plan and funding options.

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FAQ

Frequently asked questions

The programme totals 1,900 hours over 12–14 months. You set your own pace within each intake, and your tutor helps you plan the workload around your job.

You work with KiCad, LTspice, STM32CubeIDE, Vivado and MATLAB/Simulink, using free, academic or evaluation versions. Your tutor indicates the free alternative wherever one exists.

A SEIUM Institute diploma, awarded on passing the continuous assessment and the Master's Thesis. It is SEIUM's own qualification, not an official state degree; its recognition depends on the programme completed and the regulations of each country.

Yes. Modules passed in a course or postgraduate diploma in the same area are recognised in the higher programme. Ask about the recognition policy when you enrol.

A university degree in engineering, science or architecture (or equivalent professional experience), a computer able to run the software and English sufficient to read technical standards.

Start dates are set by SEIUM's faculty for each intake. Our admissions team will confirm the next available date when you apply.

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