Diploma in Timing Closure, Floorplanning and DFT
About us Diploma in Timing Closure, Floorplanning and DFT
The Diploma in Timing Closure, Floorplanning, and DFT focuses on the design and optimization of integrated circuits (ICs) to maximize performance and reliability. It covers key methodologies for Timing Closure, which ensures compliance with speed and synchronization requirements. It includes advanced Floorplanning techniques for the efficient arrangement of components on the chip and Design for Testability (DFT) strategies to facilitate verification and testing. It focuses on the use of tools and workflows to optimize design, simulation, and verification, from the synthesis stage to final circuit implementation. The program provides a solid foundation in IC design technologies and prepares professionals for roles such as ASIC design engineers, verification engineers, and integrated circuit architects. The aim is to understand the challenges inherent in IC manufacturing and how to overcome them, thereby improving competitiveness in the semiconductor industry.
Diploma in Timing Closure, Floorplanning and DFT
- Format: Hybrid
- Duration: 6–8 months
- Hours: 800 H
- Language: English / Spanish
- Registration date: 23-10-2026
- Strat date: 03-12-2026
- Available places: 2
1,580 $
Competencies and results
What you will learn
1. Mastery of Timing Closure, Floorplanning, and DFT for Integrated Circuit Design
- Understand the fundamental concepts of Timing Closure, including Setup Time, Hold Time, and Slack.
- Apply advanced Timing Analysis techniques to identify and troubleshoot timing problems in design.
- Master the Floorplanning process, optimizing the placement of cells and blocks to minimize latency and maximize efficiency.
- Use Floorplanning tools to create efficient designs and meet area and performance requirements.
- Explore the principles of Design for Testability (DFT), including Scan Chain, BIST, and Memory BIST.
- Implement DFT strategies to ensure the testability and quality of integrated circuits.
- Optimize designs to reduce power consumption and improve overall performance.
- Analyze and troubleshoot common problems related to Timing Closure, Floorplanning, and DFT.
- Use cutting-edge design methodologies to create high-performance, low-power integrated circuits.
- Learn to integrate and validate the different aspects of design, from specification to manufacturing.
2. Timing Closure Optimization, Floorplanning, and DFT for Chip Design Efficiency
2. Timing Closure, Floorplanning, and DFT Optimization for Chip Design Efficiency:
- Understand the challenges of Timing Closure in modern chip designs.
- Master Floorplanning techniques to optimize chip performance, power, and area.
- Apply Design for Testability (DFT) strategies to improve chip testability and quality.
- Analyze and mitigate skew and jitter problems in clock signal design.
- Use simulation tools and static timing analysis to identify and resolve bottlenecks.
- Optimize the placement of logic and memory cells to minimize latency and power consumption.
- Implement techniques of Power gating and clock gating to reduce dynamic and static power consumption.
Apply scan chain and boundary scan techniques to improve test coverage and manufacturability.
Understand performance specifications and optimize the design to meet them.
Develop skills in using Electronic Design Automation (EDA) tools for chip design optimization.
3. Comprehensive user-oriented design and validation (from modeling to manufacturing)
You will learn to integrate the entire product development process, from initial model conception to final validation, applying user-centered methodologies. You will develop skills in parametric design, ergonomics, simulation, sustainable materials, 3D visualization, and manufacturing management, ensuring efficient, safe solutions that meet current industry standards.
4. Master's Degree in Timing Closure, Floorplanning, and DFT: Advanced Chip and Integrated Circuit Design
4. Master’s Degree in Timing Closure, Floorplanning, and DFT: Advanced Chip and Integrated Circuit Design
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Understand the fundamental principles of timing closure, including static timing analysis (STA) and optimization techniques.
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Master floorplanning, learning to efficiently place functional blocks on the chip to optimize performance, power, and connectivity.
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Learn Design for Test (DFT) methodologies, including scan chain insertion, test pattern generation, and fault coverage.
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Use advanced Electronic Design Automation (EDA) tools to simulate, analyze, and optimize chip design.
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Apply power optimization techniques, such as clock gating and low-power design.
Perform signal and power analysis, including signal integrity analysis and power distribution management.
Address complex timing closure problems in system-level chip designs, using advanced optimization and analysis techniques.
Implement floorplanning techniques for high-performance designs, considering performance, power, and area constraints.
Design and implement efficient DFT strategies to ensure chip quality and reliability.
Analyze and troubleshoot design problems related to noise, crosstalk, and process variations.
Understand and apply industry standards and best practices in chip design.
Develop problem-solving and critical thinking skills to address complex design challenges.
Gain hands-on experience through chip design projects and the use of EDA tools.
Learn to identify and mitigate performance bottlenecks and power limitations in integrated circuit design.
Specialize in specific chip architectures, such as processors, memories, or systems-on-a-chip (SoCs).
5. Specialization in Timing Closure, Floorplanning, and DFT: Design, Optimization, and Verification of Integrated Circuits
5. Specialization in Timing Closure, Floorplanning, and DFT: Integrated Circuit Design, Optimization, and Verification
- Master the fundamental concepts of Timing Closure, including static timing analysis (STA) and techniques for addressing timing violations.
- Learn the strategies and tools for Floorplanning, optimizing the placement of functional blocks and power distribution to minimize signal delay and maximize efficiency.
- Understand the principles of Design for Test (DFT), including the insertion of scan chains, the generation of test patterns, and fault coverage.
- Apply circuit optimization techniques to improve performance, reduce power consumption, and meet timing requirements.
- Use simulation and verification tools to analyze the behavior of integrated circuits and ensure their correct operation.
- Develop skills in the design of high-performance integrated circuits, including the selection of manufacturing technologies and
- Architecture optimization.
- Analyze and solve problems related to timing closure, floorplanning, and DFT in complex integrated circuit designs.
- Become familiar with industry standards and best practices in integrated circuit design and verification.
6. Expertise in Timing Closure, Floorplanning, and DFT for Chip Design and Optimization
6. Expert Mastery of Timing Closure, Floorplanning, and DFT for Chip Design and Optimization
- Master advanced Timing Closure techniques to achieve convergence in complex designs.
- Apply state-of-the-art Floorplanning strategies to optimize chip performance and energy efficiency.
- Implement Design for Testability (DFT) methodologies to ensure chip quality and reliability.
- Understand and apply the most sophisticated timing simulation and analysis tools.
- Optimize the critical path of the design to meet speed and frequency requirements.
- Develop skills in managing timing constraints (SDC) and their impact on the design.
- Learn to identify and mitigate crosstalk and noise problems in the design stage.
- Utilize Power Optimization techniques to reduce power consumption.
- Apply design strategies that minimize chip area and manufacturing costs.
- Master the complete design flow, from specification to final verification.
chip.
Who this program is for:
Diploma in Timing Closure, Floorplanning and DFT
- Engineers with degrees in Microelectronics Engineering, Electronics, Telecommunications, or related fields.
- Integrated Circuit (IC) designers seeking to deepen their knowledge of Timing Closure, Floorplanning, and DFT.
- Professionals in the semiconductor, chip design, and electronics industries who wish to enhance their skills.
- Digital design validation and verification engineers.
Recommended requirements: Prior knowledge of digital design and logic Combinational/sequential; CAD tool handling. ES/EN B2. Support materials are provided to level knowledge.
- Standards-driven curriculum: you will work with CS-27/CS-29, DO-160, DO-178C/DO-254, ARP4754A/ARP4761, ADS-33E-PRF from the first module.
- Accreditable laboratories (EN ISO/IEC 17025) with rotor bench, EMC/Lightning pre-compliance, HIL/SIL, vibrations/acoustics.
- Evidence-oriented TFM: safety case, test plan, compliance dossierand operational limits.
- Mentored by industry: teachers with experience in rotorcraft, tiltrotor, eVTOL/UAM and flight test.
- Flexible modality (hybrid/online), international cohorts and support from SEIUM Career Services.
- Ethics and security: safety-by-design approach, cyber-OT, DIH and compliance as pillars.
1.1 Introduction to Timing Closure, Floorplanning, and DFT
1.2 Fundamental Principles of Timing Closure
1.3 Fundamentals of Floorplanning: Key Concepts
1.4 Introduction to Design for Testability (DFT)
1.5 Integrated Circuit Design Methodology and Flows
1.6 Design Tools and Environments
1.7 Delay and Timing Path Concepts
1.8 Chip Structure and Organization
1.9 Design for Testing and Verification
1.10 Examples and Basic Case Studies
2.2 Optimization Fundamentals: Key Concepts in Timing, Floorplanning, and DFT.
2.2 Timing Optimization Strategies: Delay Analysis and Resolution.
2.3 Floorplanning Optimization: Efficient Design and Resource Allocation.
2.4 Advanced DFT Techniques: Improving Testability and Coverage.
2.5 Tools and Software: Using Platforms for Optimization.
2.6 Optimization for Energy Efficiency: Reducing Consumption.
2.7 Manufacturing Considerations: Impact of Optimization on Production.
2.8 Sensitivity Analysis and Simulation: Evaluating the Optimized Design.
2.9 Integration and Verification: The Optimization Validation Process.
2.20 Case Studies: Applying Techniques to Real-World Designs.
3.3 Timing Closure Fundamentals: Analysis and Time Constraints
3.2 Floorplanning Principles: Chip Physical Layout Design
3.3 Design for Testability (DFT) Concepts: Introduction and Strategies
3.4 Timing Closure Implementation: Design Flow and Tools
3.5 Floorplanning Implementation: Techniques and Considerations
3.6 DFT Implementation: Test Insertion and Coverage
3.7 Design Verification and Validation: Timing, Floorplanning, and DFT
3.8 Design Optimization: Timing Closure, Floorplanning, and DFT
3.9 Integration into the Semiconductor Manufacturing Process
3.30 Case Study: Practical Implementation and Challenges
4.4 Fundamentals of Timing Closure: Static and Dynamic Analysis
4.2 Floorplanning: Advanced Strategies and Layout Optimization
4.3 Design for Testing (DFT): Scanning Techniques and Implementation
4.4 Performance and Energy Efficiency Optimization
4.5 Integration of Design Tools and Workflows for Timing Closure
4.6 Integrated Circuit Verification and Validation Methodologies
4.7 High-Performance Chip Design: Microarchitecture and Logic Design
4.8 Design for Manufacturability (DFM) Considerations
4.9 Challenges and Solutions in Crosstalk and Skew Mitigation
4.40 Case Study Analysis: Complex Chip Design and its Challenges
4.5
5.5 Introduction to Timing Closure, Floorplanning, and DFT: Fundamentals and Methodologies
5.5 Integrated Circuit Design: Optimization and Efficiency Principles
5.3 Design Tools and Flows for Timing Closure
5.4 Advanced Floorplanning and Placement Techniques
5.5 Design for Test (DFT): Concepts, Implementation, and Verification
5.6 Timing Closure Optimization: Delay Analysis and Correction
5.7 Floorplanning Strategies for Performance and Power
5.8 Advanced DFT: Testability and Coverage
5.9 Integrated Circuit Verification: Simulation and Static Analysis
5.50 Integrated Circuit Design: Case Studies and Practical Applications
6.6 Advanced Timing Closure Concepts: Challenges and Solutions
6.2 Expert Floorplanning: Optimization for Performance and Efficiency
6.3 Advanced Design for Testability (DFT): Strategies and Tools
6.4 Analysis and Mitigation of Timing Problems in Complex Chips
6.5 Optimization Strategies for High-Performance Floorplanning
6.6 DFT Implementation: From Design to Verification
6.7 Timing Closure Methodologies for High-Speed Design
6.8 Floorplanning for Multi-Core Chips and Systems-on-Chip (SoCs)
6.9 DFT Techniques for Different Technologies and Applications
6.60 Chip Design and Verification: Integrated Timing, Floorplanning, and DFT
6.7
7.7 Fundamentals of Timing Closure, Floorplanning, and DFT in ICs
7.2 Optimizing Timing Closure in Circuit Design
7.3 Advanced Floorplanning Techniques for Efficiency
7.4 Design for Test (DFT) and Testing Methodologies
7.7 Verification and Validation of Timing Closure
7.6 Design Tools and Flows for Timing Closure, Floorplanning, and DFT
7.7 Integrating DFT into the Design Process
7.8 Analysis and Mitigation of Timing Closure Problems
7.9 Designing High-Performance Circuits with Timing Closure, Floorplanning, and DFT
7.70 Case Studies: Practical Applications in IC Design
8.8 Introduction to DFT Engineering for Embedded Systems: Fundamentals and Applications
8.8 Design for Testability (DFT) in Embedded Systems: Key Concepts
8.3 Failure Analysis and Test Coverage in DFT Design
8.4 Implementation of Scan Chain and Boundary Scan in Embedded Systems
8.5 Floorplanning in Embedded Systems: Techniques and Strategies
8.6 Timing Closure in Embedded Systems: Specific Considerations
8.7 Integrated Circuit Design with DFT for Embedded Systems
8.8 Optimization of DFT Design for Cost and Development Time Reduction
8.8 Verification and Validation of DFT Tests in Embedded Systems
8.80 Integration of DFT into the Semiconductor Manufacturing Process for Embedded Systems
9.9 Timing Closure Fundamentals: Concepts and Methodologies
9.9 Introduction to Floorplanning: Design Considerations
9.3 Design for Testing (DFT): Principles and Applications
9.4 Integrated Circuit Design Flows
9.5 EDA Tools and Technologies for Chip Design
9.6 Basic Design Practical Exercises
9.9 Advanced Timing Closure Techniques: Optimization and Analysis
9.9 Floorplanning Strategies for Energy Efficiency
9.3 DFT Optimization: Cost Reduction and Improved Fault Coverage
9.4 Performance Analysis and Design for Production
9.5 Optimization and Simulation Tools
9.6 Case Studies of Optimized Chip Design
3.9 Implementing Timing Closure in Manufacturing Environments
3.9 Floorplanning: Manufacturing Considerations
3.3 DFT: Integration into the Manufacturing Process
3.4 Design Flows From RTL to GDSII
3.5 Design and Implementation Automation
3.6 Semiconductor Manufacturing Project Management
4.9 Advanced Timing Closure Design: Specialized Techniques
4.9 Floorplanning for Complex Chip Design
4.3 Advanced DFT: Design for High-Performance Testing
4.4 High-Performance Chip Design
4.5 Next-Generation Design and Simulation Tools
4.6 Integrated Chip Design Projects
5.9 Integrated Circuit Design and Timing Verification
5.9 Floorplanning Design and Verification
5.3 DFT Design, Implementation, and Verification
5.4 Verification and Validation Methodologies
5.5 Circuit Verification Tools
5.6 Complete Integrated Circuit Design
6.9 Timing Closure Design and Optimization
6.9 Floorplanning Design and Optimization
6.3 Design and Optimization of DFT
6.4 Chip Design and Optimization
6.5 Circuit Design Methodologies
6.6 Optimization Applications in Chip Design
7.9 Timing Closure Strategies for High-Performance Microchips
7.9 Floorplanning for High-Performance Microchips
7.3 DFT Strategies for High-Performance Microchips
7.4 High-Performance Microchip Design
7.5 Tools and Technologies for High Performance
7.6 Case Studies in High-Performance Microchips
8.9 Timing Closure in Embedded Systems Design
8.9 Floorplanning in Embedded Systems Design
8.3 DFT in Embedded Systems Design
8.4 Embedded Systems Design
8.5 Design Considerations for Embedded Systems
8.6 Embedded Systems Design Projects
Final Project — Integrated Design with TCDF: Practical Case Study
1. Introduction to the Practical Case Study: Context of Integrated Circuit Design.
2. Floorplanning: Design and Component Layout on the Chip.
3. Timing Closure: Analysis and Compliance with Time Constraints.
4. DFT (Design for Testability): Design for Chip Verification and Testing.
5. Design Implementation: Design Flow and Tools.
6. Design Optimization: Techniques to Improve Performance and Efficiency.
7. Design Verification: Simulation and Functional Validation.
8. Mask Generation and Chip Fabrication.
9. Chip Testing and Characterization: Performance Analysis.
10. Project Conclusions and Results: Final Report and Presentation.
- Hands-on methodology: test-before-you-trust, design reviews, failure analysis, compliance evidence.
- Software (depending on licenses/partners): MATLAB/Simulink, Python (NumPy/SciPy), OpenVSP, SU2/OpenFOAM, Nastran/Abaqus, AMESim/Modelica, acoustics tools, planning toolchains DO-178C.
- SEIUM Laboratories: scale rotor bench, vibrations/acoustics, EMC/Lightning pre-compliance, HIL/SIL for AFCS, data acquisition with strain gauging.
- Standards and compliance: EN 9100, 17025, ISO 27001, GDPR.
Capstone-type projects
Admissions, fees and scholarships
- Profile: Background in Computer Engineering, Mathematics, Statistics, or related fields; practical experience in NLP and valued information retrieval systems.
- Documentation: Updated CV, academic transcript, SOP/statement of purpose, project examples or code (optional).
- Process: Application → Technical evaluation of profile and experience → Technical interview → Review of case studies → Final decision → Enrollment.
- Fees:
- Single payment: 10% discount.
- Payment in 3 installments: No fees; 30% upon registration + 2 equal monthly payments of the remaining 35%.
Monthly payment: available with a 7% commission on the total; annual review.
Scholarships: based on academic merit, financial need, and promoting inclusion; agreements with companies in the sector for partial or full scholarships.
See “Calendar & Calls for Applications,” “Scholarships & Grants,” and “Fees & Financing” in the SEIUM mega-menu.
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